Gas Nitride

Processes

• Gas nitriding – one-stage & two-stage

Process Capabilities

• Gas nitriding in dissociated ammonia
• One-stage & two-stage (Floe process)
• Meets AMS 2750 (pyrometry), AMS 2759, CQI-9, etc.
• Capacities up to 4000 lbs lots
• Parts can be masked for selective hardening
• Digital furnace charting (T, t, %DA, P, N2 flow, H2 flow, etc.)

Process Features

• Substrate must contain nitride-forming element(s) – Al, Cr, Mo, V, W, etc.
• Substrate must have been previously tempered at 975°F min.
• Very thin (<.001”), very hard compound (white) layer of epsilon nitrides
• Modest (.001-.035”) nitrogen diffusion zone depth
• High case hardness, wear resistance, galling resistance, fatigue life
• Low part distortion